Qualcomm adds EV-DO Rev A and Rev. B, HSPA+, dual-carrier HSPA+ and LTE capabilities to Gobi product family. The latest modem chipsets that have been added to the Gobi product family deliver support for CDMA2000 1xEV-DO Rev. A and Rev. B, HSPA+, dual-carrier HSPA+ and LTE with integrated backwards compatibility to HSPA and EV-DO. Building on the success of Gobi technology in PC markets as an embedded module, Qualcomm is now prepared to serve the needs of additional market segments, including USB modems, e-readers, gaming devices and M2M commercial applications.
Qualcomm’s Gobi solutions include software enhancements for select MDM chipsets that will enable a common Gobi software interface (API) across multiple hardware platforms. This interface will help streamline integration efforts, spur application development among third-party developers and deliver greater flexibility to device manufacturers. The following data chipsets are now available with the Gobi API:
+ MDM6200™: supports HSPA+ data rates of up to 14.4 Mbps
+ MDM6600™: supports HSPA+ data rates of up to 14.4 Mbps and CDMA2000® 1xEV-DO Rev. A/Rev. B
+ MDM8200A™: supports HSPA+ data rates of up to 28 Mbps
+ MDM8220™: supports dual-carrier HSPA+ for data rates of up to 42 Mbps
+ MDM9200™: supports LTE data rates of up to 100 Mbps with full backward compatibility to dual carrier HSPA+
+ MDM9600™: supports LTE data rates of up to 100 Mbps with full backward compatibility to dual carrier HSPA+ and EV-DO Rev. A/Rev. B
“For the mobile user, Gobi in a Dell laptop or netbook has become synonymous with simple, reliable access to various mobile broadband networks regardless of where their travels take them,” said John Thode, Dell’s vice president, small screen devices. “With Qualcomm’s commitment to expand the Gobi program to support the latest 3G and coming 4G networks, Dell mobile devices with built-in Gobi wireless technology will deliver the best anywhere, anytime connectivity solution for digital nomads around the world.”
“Our Gobi technology is bringing the transparent, reliable and widely available connectivity of 3G to notebooks, netbooks, e-readers, routers and other market segments that are benefiting from access to mobile broadband,” said Barry Matsumori, vice president of product management for Qualcomm CDMA Technologies. “With this newly expanded roadmap, Gobi- enabled devices can bring greater value to consumers and enterprises than ever before.”
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Qualcomm's dual-carrier HSPA+ and LTE modem chipsets added to the Gobi product family
Qualcomm's dual-carrier HSPA+ and LTE modem chipsets added to the Gobi product family
Title : Qualcomm's dual-carrier HSPA+ and LTE modem chipsets added to the Gobi product family
URL : https://www.multicellphone.com/2010/03/qualcomm-dual-carrier-hspa-and-lte.html
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