ST-Ericsson is launching an extremely power-efficient and compact HSPA+ modem capable of transmitting data at speeds of up to 21Mbps. With up to 50 per cent lower power consumption than competing HSPA+ 21Mbps modems available on the market, the highly-integrated M5730 will enable ST-Ericsson’s customers to produce small, affordable and power-efficient HSPA+ smartphones, USB-dongles and embedded modules.
Mobile devices equipped with the M5730 modem, which is already being sampled by customers, will be able to offer up to double the high-speed Internet browsing time of mobile devices using other HSPA+ 21Mbps modems.
ST-Ericsson’s M5730 is the world’s first two-chip 21Mbps modem and the smallest HSPA+ 21Mbps solution to date. Using just two chips makes the M5730 very compact, reducing the bill of materials for device manufacturers. It also has exceptionally low-levels of heat dissipation enabling it to be embedded in a very wide range of devices.
The M5730 makes use of the 64-QAM advanced modulation technique, providing end-users with higher average throughput speeds and enabling mobile operators to make more efficient use of their spectrum. ST-Ericsson’s field tests with mobile operators found the use of 64-QAM technology results in an average 30 percent increase in spectral efficiency.
On Sept 22, the Global mobile Suppliers Association (the GSA) reported that 73 HSPA+ networks are currently up and running and 127 operators in 59 countries have committed to HSPA+ network deployments.
ST-Ericsson’s customers will be able to quickly roll out devices based on the M5730 as it uses the same modem protocol software as the M570 HSPA+ 21Mbps platform which has passed several major American, Asian and European mobile operator IOT tests.
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ST-Ericsson M5730 is HSPA+ modem for smartphones capable of transmitting data at speeds of up to 21Mbps
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